Mechanic BGA-IC QC-20 Adhesive Remover

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Introducing the Mechanic BGA-IC QC-20 Adhesive Remover, a powerful and essential tool for electronic repairs. This 20ml solution is specifically designed to soften and remove BGA IC chips along with resin sealants from mobile devices. Crafted with eco-friendly sealants, it efficiently tackles a variety of hardened adhesives such as phenolic aldehyde, epoxy, acrylic, polyurethane, and silicone. With its user-friendly application process, you'll be able to handle repairs swiftly and effectively. The kit includes one 20ml QC-20 Adhesive Remover, ideal for any technician’s toolkit.

The Mechanic BGA-IC QC-20 Adhesive Remover is an indispensable asset for anyone working in microelectronics repair. This 20ml liquid is expertly formulated to soften and detach BGA IC chips from mobile devices, as well as to dissolve resin sealants on circuit boards. Utilizing advanced eco-friendly sealers, this solution rapidly softens a range of cured adhesives including phenolic aldehyde, epoxy, acrylic, polyurethane, and silicone. Its effectiveness ensures that you can efficiently perform intricate repairs without damaging delicate components. To use the Mechanic QC-20, simply soak a larger absorbent cotton material in the solution and apply it evenly to the BGA IC chip from which you wish to remove the adhesive. After covering the area with plastic, allow it to sit for about 20 minutes, and repeat the process if necessary. For additional ease, apply heat to the chip to melt the adhesive further, making extraction straightforward with tweezers. The kit is designed for convenience, making it an essential addition to any professional repair workshop or DIY enthusiast’s collection. At Gremio Microelectrónica, we prioritize quality and customer service. We are committed to providing expert assistance for all your queries and ensuring that you receive the best tools for your needs. With a wide range of over 800 products available, our goal is to equip you with everything necessary for efficient mobile device repairs.

Usage ideas 1. Remove BGA IC chips from mobile devices seamlessly with the QC-20. 2. Effortlessly dissolve resin adhesives from circuit boards in two simple steps. 3. Combine with heat application for enhanced adhesive removal on tough jobs. 4. Ideal for electronics repair technicians and hobbyists working on Android and iPhone devices.

Frequently asked questions
Hi, does this work to remove CPU resin?: Yes, it will work effectively to remove CPU resin.
Can this remove displays from touch panels?: This remover is not recommended for that purpose. We suggest looking for specialized removers for display detachment.

- Marca: Mechanic
- Código universal de produto: 6971402785021
- Condição do item: Nuevo
- SKU: 6971402785021
- Dispositivos compatibles: Android, iPhone

Vendor listing title: Removedor De Pegamento Mechanic Bga-ic Qc-20